Functional Materials and Devices

Volume 517

doi: 10.4028/

Paper Title Page

Authors: Rozidawati Awang, Goh Boon Tong, Siti Meriam Ab. Gani, Richard Ritikos, Saadah Abdul Rahman

Abstract: A direct-current plasma enhanced chemical vapour deposition (PECVD) system was designed and built in-house for the deposition of...

Authors: Tan Winie, S.R. Majid, M.F. Hassan, A.K. Arof

Abstract: Hexanoyl chitosan that exhibited solubility in THF was prepared by acyl modification of chitosan. Films of hexanoyl chitosan-based polymer...

Authors: M.F. Hassan, N.H. Idris, S.R. Majid, Tan Winie, A.S.A. Khiar, A.K. Arof

Abstract: The plasticized PEO-KOH films have been investigated using the electrochemical impedance spectroscopy (EIS), X-ray diffraction (XRD) and...

Authors: O.J. Lee, S.A. Halim, K.P. Lim, Z.A. Talib, A. Huda, I. Priscilla

Abstract: The significant influences of substituting low concentration Dy at La- site for La0.667Sr0.333MnO3 perovskites compounds in structural,...

Authors: M.I.N. Isa, S.R. Majid, A.K. Arof

Abstract: A gel electrolyte system was prepared by dissolving poly(methyl methacrylate) in ethylene carbonate and propylene carbonate doped with...

Authors: Siti Aishah Hashim Ali

Abstract: A mathematical model for the transport in cathode of a lithium-ion cell is developed and analytical solutions to the model equations are...

Authors: Abdul Hadi, Iskandar Idris Yaacob, Cheah Seok Gaik

Abstract: Nanocrystalline cerium dioxide (CeO2) has been successfully synthesized by mechanochemical technique at 12, 24, 36, 48 and 60 hours milling...

Authors: B. Vengadaesvaran, R. Puteh, A.K. Arof

Abstract: Silicone modified acrylic polymer dispersion was prepared by blending methoxy functional silicone intermediate resin with acrylic polyol...

Authors: Mohd Ambar Yarmo, Raja Saadiah Raja Shariff, Siti Rohaya Omar, Juan Joon Ching, Roziana Haron

Abstract: This paper will review on the latest development on solid acid catalysts used in industries as well in research activities. Application of...

Authors: Shahrul Nizam Shahdan, Azman Jalar, Muhammad Azmi Abd Hamid

Abstract: A tin-lead solder is generally used to mount an electronic package on to a printed circuit board (PCB) of an electronic devices. In this...


Showing 21 to 30 of 61 Paper Titles