A new Approach in Residual Stresses Analysis by Speckle Interferometry

Abstract:

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The knowledge of residual stresses allows a reliable prediction of structure performances evolution, such as service life [1-3]. In this paper, we develop a new method for residual stresses determination combining Electronic Speckle Pattern Interferometry (ESPI) with the machining of a groove. The internal stress field is perturbed as the depth of the groove is increased incrementally. The structure finds a new equilibrium state generating displacements which are measured using ESPI. This method was tested on an aluminium alloy AU4G plate treated locally by an ultrasonic shot-peening. The investigation of the images obtained with the phase shifting technique and fringe patterns, makes it possible to analyze, simultaneously, the stress profile along two directions: along the depth of the structure, and along the groove direction.

Info:

Periodical:

Materials Science Forum (Volumes 524-525)

Edited by:

W. Reimers and S. Quander

Pages:

465-470

DOI:

10.4028/www.scientific.net/MSF.524-525.465

Citation:

A. Maras, G. Montay, O. Sicot, E. Rouhaud, M. François, "A new Approach in Residual Stresses Analysis by Speckle Interferometry", Materials Science Forum, Vols. 524-525, pp. 465-470, 2006

Online since:

September 2006

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Price:

$35.00

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