Effect of the Crystallization Conditions on the Epitaxial Relationship of Si Deposited on 3C-SiC(100)


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The epitaxial relationship of Si deposited on 3C-SiC was studied using both free standing 3C-SiC(100) material from Hoya and 3C-SiC thin layers deposited on Si(100) as substrates. The conditions of Si growth were varied depending on the substrate. When Si is deposited at 1000°C on (001) 3C-SiC, it is in perfect epitaxial relation with the SiC layer [100]Si//[100]SiC and [001]Si//[001]SiC. After a 20 ms flash lamp pulse on the same sample, which has the effect of fast melting of the Si top layer only, the defects in the Si are eliminated. Using free standing 3C-SiC, the deposition temperature was not limited by the Si melting point so that it was fixed at 1500°C in order to form a set of Si liquid droplets on the surface with diameters ranging from 5 to 20 μm. Surprisingly more than 60% of the Si droplets exhibit the epitaxial relation [110]Si//[001]SiC and [111]Si//[110]SiC after crystallization. The occurrence of this epitaxial relationship can be understood in terms of lattice mismatch reduction from 20% to 18.3%. The conditions of crystallization, most probably the cooling rate, seem to have a strong effect on Si orientation.



Materials Science Forum (Volumes 527-529)

Edited by:

Robert P. Devaty, David J. Larkin and Stephen E. Saddow




G. Ferro et al., "Effect of the Crystallization Conditions on the Epitaxial Relationship of Si Deposited on 3C-SiC(100)", Materials Science Forum, Vols. 527-529, pp. 1563-1566, 2006

Online since:

October 2006




[1] A. Fissel, R. Akhtariev, and W. Richter: Thin Solid Films 380 (2000), p.42.

[2] J. Zhu and J.G. Ekerdt: Journal of Crystal Growth 261 (2004), p.479.

[3] W. Skorupa, D. Panknin, W. Anwand, V. Voelskow, G. Ferro, Y. Monteil, A. Leycuras, J. Pezoldt, R. McMahon, M. Smith, J. Camassel, J. Stoemenos, E. Polychroniadisf, P. Godignon, N. Mestres, D. Turover, S. Rushworth, and A. Friedberger: Materials Science Forum Vols. 457- 460 (2004).

DOI: https://doi.org/10.4028/www.scientific.net/msf.457-460.175

[4] L.O. Bjorketun, L. Hultman, O. Kordina, and J.E. Sundgren: Journal of Materials Research 13 (1998), p.2632.

[5] T. Chassagne, G. Ferro, D. Chaussende, F. Cauwet, Y. Monteil, and J. Bouix: Thin Solid Films 402 (2002), p.83.

DOI: https://doi.org/10.1016/s0040-6090(01)01597-8

[6] W. Wegscheider, K. Ebert, G. Abstreiter, H. Cerva, and H. Oppotzer: Appl. Phys. Lett. 57 (1990), p.1496.

[7] C.H. Chu, Y.M. Lu, and M.H. Hon: Journal of Materials Science 27 (1992), p.3883.

[8] D.K. Fork, G.B. Anderson, J.B. Boyce, R.I. Johnson, and P. Mei: Appl. Phys. Lett. 68 (1996).