Wear Characteristics of ID Saw Blade in Silicon Ingot Slicing Process

Abstract:

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In this paper, the wear behavior of the ID (inner diameter) saw blade in the cutting process of silicon ingot was observed with SEM. Its wear mechanism was discussed and the relation between the blade wear and vibration, deflection was analyzed. The results show that the blade worn manners include flatted diamond, micro-fractured diamond, macro-fractured diamond, pulled-out hole, tortoise-fractured bond, and polished bond. In the abnormal working stage of a blade, however, the working surface of the blade is displayed mainly with pulled out diamond, flatted diamond, macro-fractured diamond grains. Abnormal initial tension condition will induce severe vibration and deflection, and so then lots of diamond grits fractured or pulled out too early.

Info:

Periodical:

Materials Science Forum (Volumes 532-533)

Edited by:

Chengyu Jiang, Geng Liu, Dinghua Zhang and Xipeng Xu

Pages:

157-160

DOI:

10.4028/www.scientific.net/MSF.532-533.157

Citation:

X. Wei et al., "Wear Characteristics of ID Saw Blade in Silicon Ingot Slicing Process", Materials Science Forum, Vols. 532-533, pp. 157-160, 2006

Online since:

December 2006

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Price:

$35.00

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