Modeling of Back Pressure Distribution on the Wafer Loaded in a Multi-Zone Carrier in Chemical Mechanical Polishing


Article Preview

The within-wafer non-uniformity (WIWNU) of material removal rate in chemical mechanical polishing (CMP) is important for IC manufacture. The non-uniform distributions of polishing pressure and the relative speed between the wafer and the polishing pad are main factors affecting the WIWNU. In this paper,based on the contact mechanics and the elastic plate theory, a compensate pressure computing model is presented, in which the effects of kinematic parameters are taken into acount. By modelling and calculating, the desired compensate back pressure distribution is obtained. In the last section the design of a schematic carrier with multi-zone, in which the compensate back pressure can be applied, is presented. The model and the design can be used for providing theoretical guide to the development of CMP equipments and selection of the kinematic variables in CMP process.



Materials Science Forum (Volumes 532-533)

Edited by:

Chengyu Jiang, Geng Liu, Dinghua Zhang and Xipeng Xu






Y. H. Sun et al., "Modeling of Back Pressure Distribution on the Wafer Loaded in a Multi-Zone Carrier in Chemical Mechanical Polishing", Materials Science Forum, Vols. 532-533, pp. 233-236, 2006

Online since:

December 2006




[1] T.K. Yu, Y. Chris and O. Marius: IEEE IEDM, (1993) p.865.

[2] S.R. Runnels and P. Renteln: Dielectr. Sci. Technol., Vol. 6 (1993) p.110.

[3] L.F. Gotcher: Polishing Chucks, Abrading Methods, Polishing Methods, Semiconductor Wafer Polishing Methods, and Methods of Forming Polishing Chucks, US Pat. App. No. 20020009958.

[4] K.L. Johnson: Contact Mechanics (Cambridge Univ. Press, Great Britain 1985).

[5] S.P. Timoshenko, S.W. Krieger: Theory of Plates and Shells, 2nd ed. (McGraw-Hill Publications, USA 1959).

[6] G.H. Fu and A. Chandra: Thin Solid Films Vol. 474 (2005) p.217.

[7] S. Dein and C. Jassy: IEEE Trans. on Components and Packaging Tech., Vol. 24 (2001), p.661.

In order to see related information, you need to Login.