Research on Nano-Cutting Processes Based on Parallel Molecular Dynamics
To investigate the effect of tool geometry on single-crystal silicon nano-cutting, parallel molecular dynamics (MD) simulations are carried out with different tool rake angles. In this study, a parallel arithmetic based on mechanism of spatial decomposition together with MD is applied to simulate nano-cutting processes of single-crystal silicon (100) plane by using a single-crystal diamond tool. The simulation results show that tool rake angle has great effects on cutting forces and subsurface stress, and the effect of tool rake angle variation on work-piece potential energy is not evident while cutting single-crystal Silicon (100) plane. Moreover, the analysis of cutting forces and potential energy show that there is not evident dislocation in the nano-cutting.
Chengyu Jiang, Geng Liu, Dinghua Zhang and Xipeng Xu
Y. C. Liang et al., "Research on Nano-Cutting Processes Based on Parallel Molecular Dynamics", Materials Science Forum, Vols. 532-533, pp. 357-360, 2006