A Study of Double Sided Polishing Process for Ultra-Smooth Surface of Silicon Wafer

Abstract:

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Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get ultra-smooth surface with the very stringent machining conditions. In this paper, the mechanism of ultra-smooth surface machining process was studied, the main parameters affecting the surface quality of silicon wafer, such as the polishing pad and carrier rotation speed, polishing press, polishing slurries etc. , were discussed and optimized, then ultra-smooth surface of silicon wafer with Ra 0.4nm has been obtained based on the above study. A new double sided polishing machine with computer control system equipped with a digital controlled press valve was developed, and the ultra-smooth machining process of silicon wafer was established in this paper.

Info:

Periodical:

Materials Science Forum (Volumes 532-533)

Edited by:

Chengyu Jiang, Geng Liu, Dinghua Zhang and Xipeng Xu

Pages:

472-475

DOI:

10.4028/www.scientific.net/MSF.532-533.472

Citation:

W. Li et al., "A Study of Double Sided Polishing Process for Ultra-Smooth Surface of Silicon Wafer", Materials Science Forum, Vols. 532-533, pp. 472-475, 2006

Online since:

December 2006

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Price:

$35.00

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