A Study of Double Sided Polishing Process for Ultra-Smooth Surface of Silicon Wafer
Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get ultra-smooth surface with the very stringent machining conditions. In this paper, the mechanism of ultra-smooth surface machining process was studied, the main parameters affecting the surface quality of silicon wafer, such as the polishing pad and carrier rotation speed, polishing press, polishing slurries etc. , were discussed and optimized, then ultra-smooth surface of silicon wafer with Ra 0.4nm has been obtained based on the above study. A new double sided polishing machine with computer control system equipped with a digital controlled press valve was developed, and the ultra-smooth machining process of silicon wafer was established in this paper.
Chengyu Jiang, Geng Liu, Dinghua Zhang and Xipeng Xu
W. Li et al., "A Study of Double Sided Polishing Process for Ultra-Smooth Surface of Silicon Wafer", Materials Science Forum, Vols. 532-533, pp. 472-475, 2006