A Study on Ti3SiC2 Reinforced Copper Matrix Composite by Warm Compaction Powder Metallurgy


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Increasing density is the best way to increase the performance of powder metallurgy materials. Conventional powder metallurgy processing can produce copper green compacts with density less than 8.3g/cm3 (a relative density of 93%). Performances of these conventionally compacted materials are substantially lower than their full density counterparts. Warm compaction, which is a simple and economical forming process to prepare high density powder metallurgy parts or materials, was employed to develop a Ti3SiC2 particulate reinforced copper matrix composite with high strength, high electrical conductivity and good tribological behaviors. Ti3SiC2 particulate reinforced copper matrix composites, with 1.25, 2.5 and 5 mass% Ti3SiC2 were prepared by compacting powder with a pressure of 700 MPa at 145°C, then sintered at 1000°C under cracked ammonia atmosphere for 60 minutes. Their density, electrical conductivity and ultimate tensile strength decrease with the increase in particulate concentration, while hardness increases with the increase in particulate concentration. A small addition of Ti3SiC2 particulate can increase the hardness of the composite without losing much of electrical conductivity. The composite containing 1.25 mass% Ti3SiC2 has an ultimate tensile strength of 158 MPa, a hardness of HB 58, and an electrical resistivity of 3.91 x 10-8 Ω.m.



Materials Science Forum (Volumes 532-533)

Edited by:

Chengyu Jiang, Geng Liu, Dinghua Zhang and Xipeng Xu




T. L. Ngai et al., "A Study on Ti3SiC2 Reinforced Copper Matrix Composite by Warm Compaction Powder Metallurgy", Materials Science Forum, Vols. 532-533, pp. 596-599, 2006

Online since:

December 2006




[1] S. Kubo and K. Kato: Wear, Vol. 216 (1998), p.172.

[2] D.H. He, R.R. Manory and N. Grady: Wear, Vol. 215 (1998), p.146.

[3] C. Biselli, D.G. Morris and N. Randall: Scripta. Metall. Mater., Vol. 30 (1994) No. 10, p.1327.

[4] J. Lee, J.Y. Jung, E. Lee and et al: Mater. Eng. A, Vol. 277 (2000), p.274.

[5] C.H. William: Mater. Sci. Eng. A, Vol. 244 (1998), p.75.

[6] D.W. Lee and B.K. Kim: Mater. Lett., Vol. 58(3-4) (2004), p.378.

[7] P.K. Jena, E.A. Brocchi and M.S. Motta: Mater. Sci. Eng. A, Vol. 313 (2001), p.180.

[8] I. Kyoshi and A. Masakasu: Mater. Trans. JIM, Vol. 34 (1993) No. 8, p.718.

[9] T.S. Srivatsan, N. Narendra and J.D. Troxell: Mater. Design, Vol. 21 (2000), p.191.

[10] M.W. Barsoum and T. Raghy: J. Am. Ceramic Soc., Vol. 79 (1996) No. 7, pp. (1953).

[11] H.G. Rutz and F.G. Hanejko: The Intern. J. Powder Metall., Vol. 31 (1995) No. 1, p.9.

[12] H. Rutz, F. Hanejko and S. Luk: Powder Report, Vol. 49 (1994), p.40.