Diamond Tools with Diamond Grits Set in a Predetermined Pattern
Although diamond tools have been used for over a century, the diamond grits distribution in the matrix is not uniform. This is because the large and light diamond grits tend to segregate from the small and heavy metal powder during the mixing process, hence diamond distribution in the diamond tools is intrinsically heterogeneous. As a result, the cutting performance of the diamond tools cannot be optimized. In 1997, Dr. James Chien-Min Sung applied two historical patents that can allow the design of diamond distribution according to a predetermined pattern. As the result, the life of diamond tools may be doubled; and the cutting speed, may also be twice as high. The three-dimensional saw segments with arrayed diamond grits were made back in 1999 with the improved performance as predicted. The Sung invention can allow the diamond tools industry to make ideal saw segment that has variable diamond size and diamond separation at different regions. Conventional diamond saws contain diamond grits that are distributed randomly in a metal matrix, as a result, their cutting speeds are slow and their sawing lives are short. In 1997, Dr. James C. Sung applied new patents that revealed revolutionary technology for making diamond tools with diamond grits set in a predetermined pattern. The diamond placement design was first appeared in a series of DiaGrid® products, such as wire saws and grinding wheels. In 1999, DiaGrid® pad conditioners was introduced and it has since become the world's standard for dressing pads, particularly those used for chemical mechanical planarization of semiconductor devices. In 2005, Shinhan adapted the idea and produced saw segments with diamond grits set in a predetermined pattern, their results confirmed that the sawing speed and the life were significantly improved over conventional designs.
Duk Yong Yoon, Suk-Joong L. Kang, Kwang Yong Eun and Yong-Seog Kim
J. C. Sung "Diamond Tools with Diamond Grits Set in a Predetermined Pattern", Materials Science Forum, Vols. 534-536, pp. 1101-1104, 2007