Properties of TiAl and TiAlN Thin Films by Pulsed Cathodic ARC


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TiAl and TiAlN thin films are deposited on glassy carbon and Si substrates by the pulsed cathodic arc deposition process. In our pulsed cathodic arc system, because the spatial position of plasma on the surface of the evaporation source can be controlled by pulsed arc discharge, the thickness of the TiAl and TiAlN films can be controlled at nanometer scale. Amorphous stoichiometric Ti-Al films are synthesized from one Ti-Al alloy target at room temperature by changing the number of pulses of the arc discharge.



Materials Science Forum (Volumes 534-536)

Edited by:

Duk Yong Yoon, Suk-Joong L. Kang, Kwang Yong Eun and Yong-Seog Kim




S.Y. Chun et al., "Properties of TiAl and TiAlN Thin Films by Pulsed Cathodic ARC", Materials Science Forum, Vols. 534-536, pp. 1413-1416, 2007

Online since:

January 2007




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