Electrophoretic Deposition of Ni Nano-Particles for Self-Repairing of Heat Exchanger Tubes


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The electrophoretic deposition process of Ni nano-particles in organic suspension was employed for self-repairing of heat exchanger tubes. For this purpose, Ni nano-particles prepared by levitation-gas condensation were dispersed into the solution of ethanol with the addition of dispersant. The pitted Ni alloy specimen was prepared by applying a potential of 0.9 V (vs. Ag/AgCl) in aqueous 0.1 M NaCl solution. For electrophoretic deposition of Ni nano-particles on the specimen, a constant electric field of 100 V cm-1 was applied to the specimen for 180 s in Nidispersed solution. It was found that as the electrophoretic deposition time increased, the size of the pit remarkably decreased due to the agglomeration of Ni nano-particles at the pit with a higher current value rather than the outer surfaces of the specimen with a lower current value. Moreover, the current density increased with electrophoretic deposition time and reached a constant value. From the above, it is concluded that as the electrophoretic deposition proceeds, the pit becomes smaller in size, and hence the nano-particles more extensively aggregate at the pit by lyosphere distortion.



Materials Science Forum (Volumes 534-536)

Edited by:

Duk Yong Yoon, Suk-Joong L. Kang, Kwang Yong Eun and Yong-Seog Kim




G. J. Lee et al., "Electrophoretic Deposition of Ni Nano-Particles for Self-Repairing of Heat Exchanger Tubes", Materials Science Forum, Vols. 534-536, pp. 1453-1456, 2007

Online since:

January 2007




[1] J.R. Park, Z. Szklarska-Smialowska: Corrosion Vol. 41 (1985), p.665.

[2] V.B. Rajan, G.S. Was: Corrosion Vol. 43 (1987), p.305.

[3] K. Kamada, M. Mukai, Y. Matsumoto: Mater. Lett. Vol. 57 (2003), p.2348.

[4] T. Uchikoshi, T.S. Suzuki, H. Okuyama, Y. Sakka, P.S. Nicholson: J. Eup. Ceram. Soc. Vol. 24 (2004), p.225.

[5] C. Kaya, F. Kaya, B. Su, B. Thomas, A.R. Boccaccini: Surf. Coat. Technol. Vol. 191 (2005), p.303.

[6] A.Y. Yermakov, M.A. Uimin, A.A. Mysik and T. Goto: Mater. Sci. Forum Vol. 386-388 (2002), p.455.

[7] Y. R. Uhm, W. W. Kim, and C. K. Rhee: Phys. Stat. Sol. (a) Vol. 201(8) (2004), p. (1934).

[8] J. -J. Park, S. -I. Pyun: Corros. Sci. Vol. 45 (2003), p.995.

[9] J. -J. Park, S. -I. Pyun: J. Solid State Electrochem. Vol. 7 (2003), p.380.