A Study of Debinding Behavior and Microstructural Development of Sintered Al-Cu-Sn Alloy

Abstract:

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A new approach is explored to achieve sintered aluminium alloy from metallic powder mixtures without compression or adding Mg. In this approach, mixtures of micron-sized aluminium powder (average size of 2.5 μm) and nano-sized alloying elemental powder of Cu and Sn (less than of 70nm), at appropriate proportions to compositions of Al-6wt%Cu, Al-6wt%Cu-3wt%Sn with and without adhesive binder were prepared by magnetic stirring. Then, the powder mixture was poured into a crucible and heat treated at a temperature of 600°C for 11 hours in inert atmosphere of N2 or Ar. In this paper, we investigate the debinding behavior of loosely packed Al-based powder mixture and the microstructural development and mechanical property sintered parts using a combination of thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), X-ray diffractrometry (XRD) and hardness test.

Info:

Periodical:

Materials Science Forum (Volumes 534-536)

Edited by:

Duk Yong Yoon, Suk-Joong L. Kang, Kwang Yong Eun and Yong-Seog Kim

Pages:

769-772

DOI:

10.4028/www.scientific.net/MSF.534-536.769

Citation:

J.S. Kim et al., "A Study of Debinding Behavior and Microstructural Development of Sintered Al-Cu-Sn Alloy ", Materials Science Forum, Vols. 534-536, pp. 769-772, 2007

Online since:

January 2007

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Price:

$35.00

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