A Study of Debinding Behavior and Microstructural Development of Sintered Al-Cu-Sn Alloy


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A new approach is explored to achieve sintered aluminium alloy from metallic powder mixtures without compression or adding Mg. In this approach, mixtures of micron-sized aluminium powder (average size of 2.5 μm) and nano-sized alloying elemental powder of Cu and Sn (less than of 70nm), at appropriate proportions to compositions of Al-6wt%Cu, Al-6wt%Cu-3wt%Sn with and without adhesive binder were prepared by magnetic stirring. Then, the powder mixture was poured into a crucible and heat treated at a temperature of 600°C for 11 hours in inert atmosphere of N2 or Ar. In this paper, we investigate the debinding behavior of loosely packed Al-based powder mixture and the microstructural development and mechanical property sintered parts using a combination of thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), X-ray diffractrometry (XRD) and hardness test.



Materials Science Forum (Volumes 534-536)

Edited by:

Duk Yong Yoon, Suk-Joong L. Kang, Kwang Yong Eun and Yong-Seog Kim






J.S. Kim et al., "A Study of Debinding Behavior and Microstructural Development of Sintered Al-Cu-Sn Alloy ", Materials Science Forum, Vols. 534-536, pp. 769-772, 2007

Online since:

January 2007




[1] R.Q. Guo, P.K. Rohatgi, D. Nath, J. Mater. Sci. 32(1997)3971.

[2] O. Ohashi, J. Jpn. Weld. Soc. 69 (2000) 465.

[3] C. Lall, International Journal of Powder Metallurgy 27 (1991) 315.

[4] L.S. Darken, R.W. Gurry, Physical Chemistry of Metals, McGraw-Hill, New York, (1953).

[5] T.B. Sercombe, Materials Sci. and Eng. A341 (2003) 163-168.

[6] G. Xie, O. Ohashi, M. Song, K. Mitsuishi, K. Furuya, Applied Surface Sci. 241 (2005) 102-106.

[7] Kondoh K, Kimura A, Watanabe R, Powder Metallurgy, February 2001, vol. 44, no. 2, pp.161-164(4).

[8] http: /aluminium. matter. org. uk/content/html/eng.

[9] J. -S. Kim, I. Chang, K. Jiang, C. L. Falticeanu, Sintering of loosely packed powder mixture of ultrafine Aluminium and nanopowder of Cu and Sn, Volume 2, Proceedings of EuroPM 2005, 2- 5 Oct. pp.211-216.

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