Elaboration by Tape Casting and Hot Rolling of Copper/Silicon Carbide Composite Thin Films for Microelectronic Applications


Article Preview

During the last decade, the use of metal matrix composites (MMCs) materials such as Al/SiC or CuW for microelectronic devices have made powder modules more reliable. Today, due to the continuous increasing complexity, miniaturization and high density of components in modern devices, high power microelectronic industries are looking for new adaptive thin films with high thermal conductivity, low coefficient thermal expansion, and good machinability. This paper presents an original and new elaboration method (tape casting and hot rolling) which has been optimized in order to elaborate copper/silicon carbide thin film composite materials. The first part presents the optimization of the tape casting parameters used (powder mixing; optimization of the nature and concentration of organic additives; tape casting, debinding and pre-sintering conditions). In the second part, the main characteristics of thin film obtained are discussed, such as thermomechanical properties of the composite Cu/SiC thin films.



Materials Science Forum (Volumes 534-536)

Edited by:

Duk Yong Yoon, Suk-Joong L. Kang, Kwang Yong Eun and Yong-Seog Kim




P. M. Geffroy et al., "Elaboration by Tape Casting and Hot Rolling of Copper/Silicon Carbide Composite Thin Films for Microelectronic Applications", Materials Science Forum, Vols. 534-536, pp. 881-884, 2007

Online since:

January 2007




[1] K.M. Shu, G.C. Tu, Materials Science and Engineering A00, 2002, pp.1-12.

[2] S.F. Corbin, X. Zhao-jie, H. Henien, P:S. Apte, Materials Science and Engineering, pp.192-203, (1999).

[3] J. Alcok, D. Stephenson, Materials World, pp.13-14, February (2000).

[4] J.C. Williams, vol. 9 ceramic fabrication processes, Academic Press New-York, pp.173-197, (1976).

[5] J. Böhnlein-Mauß, W. Sigmund, G. Wegner, W.H. Meyer, F. Heßel, K. Seitz, A. Roosen, Advanced Materials, Nº2, pp.73-81.

DOI: https://doi.org/10.1002/adma.19920040203

[6] R. Moreno, American Ceramic Society Bulletin, vol. 71, Nº11, pp.1647-1657, (1992).

[7] E.H. Kerner, The elastic and thermo-elastic field of ellipsoidal inclusion and related problems, Proc. R. Soc. Lond. , 1957, vol. A421, 376-396.

[8] Tessier-Doyen, Etude expérimentale et Numérique du comportement thermomécanique de matériaux réfractaires modèles, Thesis, University of Limoges.