Ultrasonic Friction Power in Microelectronic Wire Bonding

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An integrated sensor method is used to measure interfacial temperature profiles with an ultrasonic friction test process. The profiles are compared to numerical results obtained by a transient thermal 2D axisymmetric finite elements (FE) analysis. In the experiments, the 50 $m diameter gold balls used in wire bonding are deformed by the capillary tool during impacting on the flat surface of a silicon chip (contact zone). The deformed balls then are pressed onto the SiO2 layer on the chip and vibrated with various amplitudes of 128 kHz ultrasonics. The 52 $m diameter contact zone is surrounded in 14 $m distance by a 50  aluminum resistor which is used as a resistive temperature detector. Temperature increases of typically 0.18 K and up to 0.3 K are measured by the sensor close to the heat source at the contact zone, corresponding to 3.1 K and 5.2 K at the interface as suggested by the FE model. With typical bonding parameters, the contact zone friction power is determined to be 4.4 mW which is less than 2 % of the electrical energy delivered to the used ultrasonic transducer type.

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Periodical:

Materials Science Forum (Volumes 539-543)

Main Theme:

Edited by:

T. Chandra, K. Tsuzaki, M. Militzer , C. Ravindran

Pages:

3920-3925

Citation:

M. Mayer and A. Zwart, "Ultrasonic Friction Power in Microelectronic Wire Bonding", Materials Science Forum, Vols. 539-543, pp. 3920-3925, 2007

Online since:

March 2007

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$38.00

[1] G. G. Harman and K. O. Leedy, An experimental model of the microelectronic ultrasonicwire bonding mechanism, Proc. 10th Annu. Reliability Physics Conf., LasVegas, pp.49-56, (1972).

[2] M. Mayer, O. Paul, D. Bolliger, and H. Baltes, In-situ Calibration of Wire Bonder Ultrasonic System Using Integrated Microsensor, in Proc. 2nd Electr. Packaging Technol. Conf. EPTC98, Singapore, pp.219-223, (1998).

DOI: https://doi.org/10.1109/eptc.1998.756005

[3] J. Schwizer, M. Mayer, O. Brand, Force Sensors For Microelectronic Packaging Applications, Springer, ISBN: 3540221875, (2004).

[4] M. Mayer and J. Schwizer, Thermosonic Ball Bonding Model based on Ultrasonic Friction Power, " Proc. Electronic Packaging Technology Conference EPTC, 03 (IEEE), Singapore, pp.738-743, (2003).

DOI: https://doi.org/10.1109/eptc.2003.1271615

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