Coated Conductor: Some Critical Aspects from Substrate to Device


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This work reports some new studies related to critical aspects in the development of coated conductors (CC). New bi-axially textured tapes based on commercial copper alloys were fabricated and tested as substrates for LZO buffer layer deposited by chemical solution deposition (CSD). Such a layer form cube texture on NiW5 and Cu55Ni45 with an identical or even better texture than that of the substrate. It was shown that a S c(2x2) sub-layer formed at the metallic surface as a positive effect on the nucleation. The crystallisation of LZO on Cu55Ni45 still has to be improved, being inhibited by trapped C in the film. Recent progresses using our continuous MOCVD system are shown. A CC fabricated by an all MOCVD process has been obtained on SS/YSZIBAD substrate with high transport critical current (170 A/cm-width, at 77 K). It is also shown that LZOMOD can efficiently protect Ni5W RABITS from oxidation during deposition of CeO2 layer by MOCVD under 30-40% O2 partial pressure. This opens the possibility to fabricate a CC on RABITS by MOCVD. This shows that a mixed MOD/MOCVD approach could be efficient. Finally a 2m long CC SS/YSZIBAD has been tested for fault current limiter applications. Best limitation was observed at 86 K where an equivalent energy of 340 J has been dissipated in the CC during 12 ms without apparent damage of the CC. In a subsequent operation, the CC was however destroyed. The causes are discussed in the perspective to design better architectures for this application.



Materials Science Forum (Volumes 546-549)

Edited by:

Yafang Han et al.




P. Odier et al., "Coated Conductor: Some Critical Aspects from Substrate to Device", Materials Science Forum, Vols. 546-549, pp. 1855-1864, 2007

Online since:

May 2007




[1] E. Vinot, V. Leconte, G. Meunier, P. Tixador : IEEE Transactions on Magnetics, Vol. 38, (2002), p.3661.

[2] J.A. Usoskin, H.C. Freyhardt : MRS Bulletin Vol. 29 (2004), p. 583R.

[3] Teranishi, T. Izumi, Y. Shioara: Supercond. Sci. Technol . Vol. 19 (2006), p. S4.

[4] X. Obradors et al: Supercond. Sci. Technol . Vol. 19 (2006), p. S13.

[5] See the web site: http: /phx. corporate-ir. net.

[6] Y.X. Zhou, R. Naguib, H. Fang, K. Salama: Supercond. Sci. Technol. Vol. 17 (2004), p.947.

[7] J. Eickemeyer et al: Physica C Vol. 372-376 (2002), p.818.

[8] N.A. Yust et al: Supercond. Sci. Technol. Vol. 18 (2005), p.9.

[9] S. Piñol, J. Diaz, M. Segarra, F. Espiell: Supercond. Sci. Technol. Vol. 14 (2001), p.11.

[10] C. Cantoni et al: Supercond. Sci. Technol., Vol. 17 (2004), p. S341.

[11] J.L. Soubeyroux et al: IEEE-Trans Applied Superconductivity Vol. 15 (2005), p.2687.

[12] Z.M. Yu et al : Mat. Sci. Eng. B, Vol 130 (2006), p.126.

[13] R.W. Schwartz, T. Schneller, R Waser: C.R. Chimie, Vol. 7 (2004), p.433.

[14] C. Cantoni et al: J. Mat. Res., Vol. 17 (2002), p.2549.

[15] F. Sandiumenge, A. Cavallaro, J. Gasquez, T. Puig, X. Obradors, J. Abrial, H.C. Freyhardt: Nanotechnology, Vol. 16 (2005), p.1809.

[16] N.L. Wu, S.Y. Wandn I.A. Rusakova : Science vol 285 (1999), p.1375.

[17] S. Beauquis, C. Jimenez, F. Weiss : in High Temperature Superconduictivity, Edited by A. Narlikar, Springer Berlin, 2004, p.115.

[18] L. Vergnieres et al: IEEE-trans. Appl. Sup. Vol. 15 (2005), p.2579.

[19] P. Tixador, C. Villard, Y. Cointe : Supercond. Sci. Technol. Vol. 19 (2006), p. S118.

[20] YX Zhou, R. Naguib, H. Fang, K. Salama : Supercond. Sci. Technol. Vol. 17 (2004), p.947.

[21] de Boer: Proceeding ITOCOM vol. 12 (1999), p.944.

[22] K. Knoth et al: Supercond. Sci. Technol. Vol. 18 (2005), p.334.

[23] S. Sathyamurthy, M. Paranthaman, H.Y. Zhai,: J. Mater. Res. Vol. 19 (2004), p.2117.

[24] Z.M. Yu, un published.

[25] F.F. Lange: Science Vol. 273 (1996) p.903.