New Cu-Ni Substrate for Coated Conductors

Abstract:

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A new approach of Cu-Ni substrate is reported, where the cubic textured Cu tape was fabricated by thermal-mechanical process, then a Ni layer was electro-deposited on the cubic textured Cu substrate. This approach is also suitable for fabricating long cubic textured metallic substrate for coated conductors. The formation of substrate texture and its thermal stability were investigated by XRD. After electro-depositing Ni layer, the sample has sharper cubic texture with ω = 5.2o and φ = 7.1o, and samples’ texture becames even better (ω = 5 o and φ = 5.2o) after annealing at 950°C for 30min.

Info:

Periodical:

Materials Science Forum (Volumes 546-549)

Edited by:

Yafang Han et al.

Pages:

1877-1880

DOI:

10.4028/www.scientific.net/MSF.546-549.1877

Citation:

Z. M. Yu et al., "New Cu-Ni Substrate for Coated Conductors", Materials Science Forum, Vols. 546-549, pp. 1877-1880, 2007

Online since:

May 2007

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Price:

$35.00

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