New Cu-Ni Substrate for Coated Conductors


Article Preview

A new approach of Cu-Ni substrate is reported, where the cubic textured Cu tape was fabricated by thermal-mechanical process, then a Ni layer was electro-deposited on the cubic textured Cu substrate. This approach is also suitable for fabricating long cubic textured metallic substrate for coated conductors. The formation of substrate texture and its thermal stability were investigated by XRD. After electro-depositing Ni layer, the sample has sharper cubic texture with ω = 5.2o and φ = 7.1o, and samples’ texture becames even better (ω = 5 o and φ = 5.2o) after annealing at 950°C for 30min.



Materials Science Forum (Volumes 546-549)

Edited by:

Yafang Han et al.




Z. M. Yu et al., "New Cu-Ni Substrate for Coated Conductors", Materials Science Forum, Vols. 546-549, pp. 1877-1880, 2007

Online since:

May 2007




[1] Y.X. Zhou, R. Naguib, H. Fang, K. Salama: Supercond. Sci. Technol. 17, 947 (2004).

[2] J. Eickemeyer D. Selbmann, R. Opitz, H. Wendrock, E. Maher, U. Miller, W. Prusseit: Physica C 372-376, 818 (2002).


[3] B. de Boer, J. Eickemeyer, N. Reger, G.R.L. Fernandez, J. Richter, B. Holzapfel, L. Schultz, W. Prusseit, P. Berberich: Acta Materialia 49, 1421 (2001).


[4] J.R. Thompson, A. Goyal, D.K. Christen, D.M. Kroeger: Physica C 370, 169 (2002).

[5] J.L. Soubeyroux, C.E. Bruzek, A. Girard, J.L. Jorda: IEEE-Trans Applied Superconductivity 15, 2687 (2005).

[6] K. Shi, Y. Zhou, J. Meng, J. Yang, G.Y. Hu, H.W. Gu, G.S. Yuan: Physica C 386, 353 (2003).

[7] N.A. Yust, R. Nekkanti, L. B Brunke, R. Srinivasan, P.N. Barnes: Supercond. Sci. Technol. 18, 9 (2005).

[8] M.J. Jin, S.C. Han, T.H. Sung, K. No: Physica C 344, 243 (2000).

[9] S. Piñol, J. Diaz, M. Segarra, F. Espiell: Supercond. Sci. Technol. 14, 11 (2001).

[10] N.A. Rutter, A. Goyal, C.E. Vallet, F.A. List, D.F. Lee, L. Heatherly, D.M. Kroeger: Supercond. Sci. Technol. 17, 527 (2004).

[11] Y.X. Zhou, L. Sun, X. Chen, H. Fang, P.T. Putman, K. Salama: The manufacturing of an electroplated Ni layer on textured Cu substrate for Cu-based HTS coated conductors. Supercond. Sci. Technol. 18, 107 (2005).


[12] C.V. Varanasi, P.N. Barnes, N.A. Yust: Supercond. Sci. Technol. 19, 85 (2006).

[13] T. Aytug, M. Paranthaman, J.R. Thompson, A. Goyal, N. Rutter, H.Y. Zhai, A.A. Gapud, A.O. Ijaduola, D.K. Christen: Applied Physics Letters, 83(19), 3963 (2003).


[14] C. Cantoni, D.K. Christen, E.D. Specht, M. Varela, J.R. Thompson, A. Goyal, C. Thieme, Y, Xu, S.J. Pennycook: Supercond. Sci. Technol., 17 (2004) S341-S344.


[15] N.A. Pangarov: Journal of electroanalytical chemistry, 9, 70-85(1965).

[16] J Amblard, M. Froment and N. Spyrellis, Surface Technology, 5, 205-234 (1977).