Through-Thickness Microstructure, Texture and Strength Gradients in AA 7055 Rolled Plate

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Through-thickness microstructure, texture and mechanical property gradients in the longitudinal section of AA 7055 rolled plate have been investigated using electron back-scattered diffraction (EBSD) technique. Quantitative analysis of the microstructure and texture through the plate thickness was conducted. It was found that the microstructure and texture are obviously non-homogeneous through the plate thickness. From center to surface, more equiaxed grains are observed. As expected, the degree of recrystallization increases with increasing the S value. The grains in the center layer exhibited preferential orientations while the most grains near the surface presented a random one. The strength of each observed layer has also been tested.

Info:

Periodical:

Materials Science Forum (Volumes 546-549)

Edited by:

Yafang Han et al.

Pages:

957-960

Citation:

J.Z. Chen et al., "Through-Thickness Microstructure, Texture and Strength Gradients in AA 7055 Rolled Plate", Materials Science Forum, Vols. 546-549, pp. 957-960, 2007

Online since:

May 2007

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$38.00

[1] Starke Jr. EA, Staley JT: Prog. in Aero. Sci. 32 (1996) 131-172.

[2] James C. Williams, Edgar A. Starke, Jr.: Acta Mater. 51 (2003) 5775-5799.

[3] T. S. Srivatsan, S. Sriram: J. Mater. Sci. 32 (1997) 2883-2894.

[4] C.W. Lee, Y.H. Chung, K.K. Cho, M.C. Shin: Mater. Design 18 (1997) 327-332.

[5] T.S. Srivatsan: Mater. Design 23 (2002) 141-151.

[6] O.V. Mishin, B. Bay, D. Juul Jensen: Metal. Mater. Trans. A 31 (2000) 1653-1662.

[7] O. Engler, M. -Y. Huh, C.N. Tomé: Mater. Trans. A 31 (2000) 2299-2315.

[8] W.C. Liu and J.G. Morris: Mater. Trans. A 36 (2005) 1329-1338.

[9] H. Jazaeri, F.J. Humphreys: Acta Mater. 52 (2004) 3251-3262.

[10] P.S. Bate, F.J. Humphreys, N. Ridley, B. Zhang: Acta Mater. 53 (2005) 3059-30690.

[11] O.V. Mishin, B. Bay, G. Wither, D. Juul Jensen: Acta Mater. 52 (2004) 5761-5770.

[12] K.K. Cho, Y.H. Chung, C.W. Lee, S.I. Kwun, M.C. Shin: Scripta Mater. 40 (1999) 651-657.

[13] M.J. Starink, S.C. Wang: Acta Mater. 51 (2003) 5131-5150. 550 560 570 580 590 600 610 620 0. 95 0. 71 0. 47 0. 24 Yeild strength, MPa S 0 Fig. 7 Changes in the yeild strength with the plate thickness (S value).

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