Micro-Photoluminescence Mapping of Defect Structures in SiC Wafers

Abstract:

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Micro-photoluminescence can be used to image electrically active structural defects in SiC. Under suitable excitation conditions it is possible to observe both band-edge PL and near bandedge PL from recombination via a shallow boron acceptor. The intensity of the band-edge emission is related to the carrier lifetime – and is reduced by the presence of structural or interfacial defects. The intensity of the deep level PL is a complex function of the number of radiative centers and the number of centers limiting carrier lifetime. Micro-PL mapping can provide information on the spatial distribution of electrically active defects in SiC.

Info:

Periodical:

Materials Science Forum (Volumes 556-557)

Edited by:

N. Wright, C.M. Johnson, K. Vassilevski, I. Nikitina and A. Horsfall

Pages:

383-386

DOI:

10.4028/www.scientific.net/MSF.556-557.383

Citation:

J. Hennessy and T. Ryan, "Micro-Photoluminescence Mapping of Defect Structures in SiC Wafers", Materials Science Forum, Vols. 556-557, pp. 383-386, 2007

Online since:

September 2007

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Price:

$35.00

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