Submicrocristalline Structure in Copper after Different Severe Plastic Deformation Schemes
The structure and properties of oxygen-free copper (99,98%) were studied after different types of severe plastic deformation (SPD): equal-channel angular pressing (ECAP), multiaxial deformation (MD), and accumulative roll bonding (ARB) as a function of the strain at room temperature (to a true strain of 30-40). The SPD facilitates the formation of submicrocrystalline structure with a grain size of 200-250 nm and predominantly high angle boundaries (83-94%). ECA pressing leads to the formation of the most uniform submicrocrystalline structure.The strength characteristics increase with increasing strain and reach the steady stage at ε ≈ 5. At the steady stage, UTS = 460-480 MPa at ARB, and MD, while UTS at ECAP is somewhat lower, 430-440 MPa. The smallest "steady" values EL = 4 - 5% were obtained in the case of ARB, and the maximum EL = 18% was obtained at MD.
S.-J.L. Kang, M.Y. Huh, N.M. Hwang, H. Homma, K. Ushioda and Y. Ikuhara
S. V. Dobatkin et al., "Submicrocristalline Structure in Copper after Different Severe Plastic Deformation Schemes", Materials Science Forum, Vols. 558-559, pp. 189-194, 2007