Dynamic Recrystallization in Copper and Copper-Tin Alloys

Abstract:

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Copper, Cu-2%Sn and Cu-4.5%Sn alloys have been deformed in plane strain compression at temperatures up to 700oC and the evolution of the microstructures and textures determined by high resolution EBSD. The effect of the solute is to raise the temperature at which dynamic recrystallization occurs and to significantly reduce the size of the dynamically recrystallized grains. In all the materials, there is a small increase in the cube texture component on dynamic recrystallization. The boundary bulges which precede recrystallization are different in the copper and Cu-Sn alloys, although in both materials there is evidence that local deformation in the boundary regions plays a significant role in dynamic recrystallization.

Info:

Periodical:

Materials Science Forum (Volumes 558-559)

Edited by:

S.-J.L. Kang, M.Y. Huh, N.M. Hwang, H. Homma, K. Ushioda and Y. Ikuhara

Pages:

449-456

DOI:

10.4028/www.scientific.net/MSF.558-559.449

Citation:

D.T. McDonald et al., "Dynamic Recrystallization in Copper and Copper-Tin Alloys", Materials Science Forum, Vols. 558-559, pp. 449-456, 2007

Online since:

October 2007

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Price:

$35.00

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