Limit for Controlling Stabilization of Cu Powder Prepared from Cu2o-H2O System


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Ultrafine dispersed copper powders were prepared from copper (I) oxide (Cu2O) slurry by a wet chemical reduction with hydrazine as a reductant. Palladium chloride (PdCl2) was used as a nucleator along with its polymer stabilizer, polyvinylpyrrolidone (PVP). Sodium pyrophosphate (Na4O7P2) was added as a surfactant. It was found that the use of Cu2O and Na4O7P2 exhibit very strong impact on dispersity of the prepared Cu powders. In this study, we indicate the critical conditions at which the particles aggregation still occurs even though the powders produced at high zeta potential resulted from an appropriate addition of Na4O7P2.



Materials Science Forum (Volumes 558-559)

Edited by:

S.-J.L. Kang, M.Y. Huh, N.M. Hwang, H. Homma, K. Ushioda and Y. Ikuhara




H. T. Hai et al., "Limit for Controlling Stabilization of Cu Powder Prepared from Cu2o-H2O System", Materials Science Forum, Vols. 558-559, pp. 741-746, 2007

Online since:

October 2007




[1] G.S. Whiting, G.L. Bolton, B.R. Sutherland, B.H. Rosof, Production of very fine hydrometallurgical powders, in: A. Lawley, A. Swanson (Eds. ), Advances in Powder Metallurgy and Particulate Materials, Vol. 1, Metal Powder Industries Federation, American Powders Metallurgy Institute, NJ, 1993, pp.107-117.


[2] S. Wu, H. Oin and P. Li: J. Univ. Sci. Technol. B. Vol. 13 (2006) p.250.

[3] R. Togashi and T. Nagai: Hydrometallurgy. Vol. 11 (1983), p.149.

[4] F. Fievet, J.P. Lagier and M. Figlarz: MRS Bul. December (1989), p.29.

[5] R.J. Hunter, Foundations of Colloid Science, Vol. 1 (Clarendon Press, Oxford, UK, 1987), p.443.

[6] J.G. Ahn, T.H. Hoang, D.J. Kim, J.R. Lee, C.O. Kim and H.S. Chung, Effect of Na4O7P2 on Cu powder preparation from Cu2O-water slurry system: J. Phys. Chem. (Submitted).

[7] J. Th.G. Overbeek in H.R. Kruyt (Ed. ), Colloid Science, Vol. 1, Elsevier, Amsterdam, 1952, p.58.

[8] T. Matsoukas, E. Gulari: J. Colloid Interface Sci. Vol. 124 (1988), p.252.