Unusual Wetting Behavior of Liquid Metals on Porous Layer Formed at Surface of Iron Substrate Prepared by Oxidation-Reduction Process
Unusual wetting behavior of liquid Cu was found on a surface-oxidized iron substrate in reducing atmosphere. Liquid Cu wetted and spread very widely on the iron substrate when a droplet was attached with the substrate in Ar-10%H2 after the surface oxidation of the substrate. The oxidationreduction process fabricates a porous layer at the surface of the iron substrate. The pores in the porous iron layer are 3-dimensionally interconnected. Thus, liquid metals, which are contacted with the reduced iron samples, penetrate into these pores by capillary force to cause the unusual wetting behavior. It has been already confirmed that liquid Ag, Sn, In and Bi show this phenomenon onto surface-porous iron samples as well as liquid Cu. This unusual wetting behavior of a liquid metal has been correlated to the normal contact angle of the liquid metal on a flat iron substrate.
Young Won Chang, Nack J. Kim and Chong Soo Lee
N. Takahira et al., "Unusual Wetting Behavior of Liquid Metals on Porous Layer Formed at Surface of Iron Substrate Prepared by Oxidation-Reduction Process", Materials Science Forum, Vols. 561-565, pp. 1699-1701, 2007