Dependence of Vickers Hardness on Annealing Temperature at Co/Cu Multilayered Films

Abstract:

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Co/Cu and Ni/Cu multilayers fabricated by electroplating technique were annealed at various temperatures in order to investigate thermal stability of multilayered structures. Vickers hardness tests on the annealed Co/Cu and Ni/Cu multilayers were conducted at room temperature. It was recognized that after the annealing at 1023K the Co/Cu multilayer still maintained the hardness of as-deposited state. On the other hand, the hardness of Ni/Cu multilayer was almost identical to copper substrate after the annealing at 903K.

Info:

Periodical:

Materials Science Forum (Volumes 561-565)

Main Theme:

Edited by:

Young Won Chang, Nack J. Kim and Chong Soo Lee

Pages:

2399-2402

DOI:

10.4028/www.scientific.net/MSF.561-565.2399

Citation:

Y. Kaneko et al., "Dependence of Vickers Hardness on Annealing Temperature at Co/Cu Multilayered Films", Materials Science Forum, Vols. 561-565, pp. 2399-2402, 2007

Online since:

October 2007

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Price:

$35.00

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