Dependence of Vickers Hardness on Annealing Temperature at Co/Cu Multilayered Films


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Co/Cu and Ni/Cu multilayers fabricated by electroplating technique were annealed at various temperatures in order to investigate thermal stability of multilayered structures. Vickers hardness tests on the annealed Co/Cu and Ni/Cu multilayers were conducted at room temperature. It was recognized that after the annealing at 1023K the Co/Cu multilayer still maintained the hardness of as-deposited state. On the other hand, the hardness of Ni/Cu multilayer was almost identical to copper substrate after the annealing at 903K.



Materials Science Forum (Volumes 561-565)

Main Theme:

Edited by:

Young Won Chang, Nack J. Kim and Chong Soo Lee




Y. Kaneko et al., "Dependence of Vickers Hardness on Annealing Temperature at Co/Cu Multilayered Films", Materials Science Forum, Vols. 561-565, pp. 2399-2402, 2007

Online since:

October 2007




[1] D.M. Tench and J.T. White: J. Electrochem. Soc. Vol. 138 (1991), p.3757.

[2] S. Menezes and D.P. Anderson: J. Electrochem. Soc. Vol. 137 (1990), p.440.

[3] D. Simunovich, M. Schlesinger and D.D. Snyder: J. Electrochem. Soc. Vol. 141 (1994), p. L10.

[4] B.M. Clemens, H. Kung and S.A. Barnett: MRS Bulletin (1999), p.20.

[5] Y. Kaneko, Y. Mizuta, Y. Nishijima and S. Hashimoto: J. Mater. Sci. Vol. 40 (2005), p.3231.

[6] K.D. Bird and M. Schlesinger: J. Electrochem. Soc. Vol. 142 (1995), p. L65.

[7] S. Kashiwabara, Y. Jyoko and Y. Hayashi: Physica B Vol. 239 (1997), p.47.

[8] J.J. Kelly, M. Cantoni and D. Landolt: J. Electrochem. Soc. Vol. 148 (2001), p.620.

[9] M. Bobeth, M. Hecker, C. Pompe, C.M. Schneider, J. Thomas, J. Ullrich and K. Wetzig: Z. Metallkd. Vol. 92 (2001), p.810.