Dependence of Vickers Hardness on Annealing Temperature at Co/Cu Multilayered Films
Co/Cu and Ni/Cu multilayers fabricated by electroplating technique were annealed at various temperatures in order to investigate thermal stability of multilayered structures. Vickers hardness tests on the annealed Co/Cu and Ni/Cu multilayers were conducted at room temperature. It was recognized that after the annealing at 1023K the Co/Cu multilayer still maintained the hardness of as-deposited state. On the other hand, the hardness of Ni/Cu multilayer was almost identical to copper substrate after the annealing at 903K.
Young Won Chang, Nack J. Kim and Chong Soo Lee
Y. Kaneko et al., "Dependence of Vickers Hardness on Annealing Temperature at Co/Cu Multilayered Films", Materials Science Forum, Vols. 561-565, pp. 2399-2402, 2007