Micromechanical Responses of Sn-3.5Ag-xCo Lead-Free Solders by Nanoindentation

Abstract:

Article Preview

The lead-free casting solders Sn-3.5Ag-xCo (x = 0, 0.1, 0.5 and 1.0 mass%, respectively) were subjected to isothermal aging at 150°C for 0, 1008 and 2016 h, respectively. The nanoindentation methodology was employed herein to assess the mechanical properties. In particular, the strain rate sensitivity index value was derived from the creep deformation at the dwell time of the target constant load using Mayo-Nix theory. Basically, there is no remarkable tendency of the variation of Young’s modulus after aging, while to some extent, the hardness of the alloys drops. The strain rate sensitivity index value continues to decrease with the prolonged aging time. The solder grain growth and the coarsening of the intermetallics namely, Ag3Sn and CoSn2, are responsible for the mechanical evolution of the alloys. The 1.0% (mass%) Co additive improved the hardness of the solder alloy, and caused the decrease of the strain rate sensitivity value.

Info:

Periodical:

Materials Science Forum (Volumes 580-582)

Edited by:

Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na

Pages:

209-212

DOI:

10.4028/www.scientific.net/MSF.580-582.209

Citation:

F. Gao et al., "Micromechanical Responses of Sn-3.5Ag-xCo Lead-Free Solders by Nanoindentation", Materials Science Forum, Vols. 580-582, pp. 209-212, 2008

Online since:

June 2008

Export:

Price:

$35.00

In order to see related information, you need to Login.