Characteristic of Electrochemical Migration on Flexible Printed Circuit Board

Bo In Noh; Jong Bum Lee; Bo Young Lee; Seung Boo Jung

doi:10.4028/www.scientific.net/MSF.580-582.229

Paper Titles

Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)
p.213

An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)
p.217

Estimation of Thermal Fatigue Resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
p.221

Small-Scale Resistance Welding of Crossed TiNi Fine Wire
p.225

Characteristic of Electrochemical Migration on Flexible Printed Circuit Board
p.229

Analysis of Solder Fatigue in Electronic Packaging Using a Mesh-Insensitive Structural Stress Method
p.233

Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder
p.239

Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder
p.243

Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test
p.247

HomeMaterials Science ForumMaterials Science Forum Vols. 580-582Characteristic of Electrochemical Migration on...

Characteristic of Electrochemical Migration on Flexible Printed Circuit Board

Abstract:

The electrochemical migration (ECM) with flexible printed circuit board (PCB) was affected by factors such as distance between the electrodes and bias voltage using water drop (WD) test. The rate of migration was increased by decreasing the distance between electrodes of the opposite polarity and increasing the bias voltage.