Characteristic of Electrochemical Migration on Flexible Printed Circuit Board
The electrochemical migration (ECM) with flexible printed circuit board (PCB) was affected by factors such as distance between the electrodes and bias voltage using water drop (WD) test. The rate of migration was increased by decreasing the distance between electrodes of the opposite polarity and increasing the bias voltage.
Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na
B. I. Noh et al., "Characteristic of Electrochemical Migration on Flexible Printed Circuit Board", Materials Science Forum, Vols. 580-582, pp. 229-232, 2008