Characteristic of Electrochemical Migration on Flexible Printed Circuit Board

Abstract:

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The electrochemical migration (ECM) with flexible printed circuit board (PCB) was affected by factors such as distance between the electrodes and bias voltage using water drop (WD) test. The rate of migration was increased by decreasing the distance between electrodes of the opposite polarity and increasing the bias voltage.

Info:

Periodical:

Materials Science Forum (Volumes 580-582)

Edited by:

Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na

Pages:

229-232

DOI:

10.4028/www.scientific.net/MSF.580-582.229

Citation:

B. I. Noh et al., "Characteristic of Electrochemical Migration on Flexible Printed Circuit Board", Materials Science Forum, Vols. 580-582, pp. 229-232, 2008

Online since:

June 2008

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Price:

$35.00

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