Advanced Welding and Micro Joining / Packaging for the 21st Century
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The aim of this special collection of papers on the theme of “Advanced Welding and Micro Joining/Packaging for the 21st Century” was to review and analyze the state-of-the-art concerning the welding and joining/packaging technologies which are essential to the production of structures ranging from the compact to the ultra-large.
This extensive collection of 164 peer-reviewed papers will provide the reader with an unparalleled guide to the most up-to-date knowledge available concerning these fields.
Review from Ringgold Inc., ProtoView: The 2007 International Welding/Joining Conference-Korea was held in Seoul from May 10-12, and this collection of peer-reviewed papers from the proceedings reflect the event theme of "Advanced Welding and Micro Joining/Packaging in the 21st Century," and should provide material science engineers and researchers with plenty of relevant data. Edited by Lee (Hanyang U.), Lee (POSCO), Park (U. of Ulsan) and Na (KAIST), this volume focused on innovative manufacturing technologies used for both compact and large structures, and the testing and research required to demonstrate the safety and resilience of such joining/welding approaches. New methods such as plasma coating, UV laser bonding, post weld heat treatment, ultrasonic aluminum wire wedge bonding and many more are scrutinized in this large and detailed reference. Note: although the series says this is a multi-volume title, it's published in a single volume.