Investigation of 2-DOF Precision Positioning System for IC Packaging

Abstract:

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A new 2-DOF positioning table of high speed and accuracy, directly driven by voice coil actuator, is put forward, which can be applied to IC packaging for wafer wire bonding equipment. With the help of a novel elastic decoupling mechanism, the driving element is mounted on the baseboard, diminishing its moving inertia, improving its dynamic performance. By establishing dynamic model of VCA and positioning table, an electromechanical coupling control system based on displacement PID controller is proposed. The prototype experiment shows that the new 2-DOF positioning system is of higher speed and higher accuracy than the traditional ones.

Info:

Periodical:

Materials Science Forum (Volumes 628-629)

Edited by:

Dongming Guo, Jun Wang, Zhenyuan Jia, Renke Kang, Hang Gao, and Xuyue Wang

Pages:

363-368

DOI:

10.4028/www.scientific.net/MSF.628-629.363

Citation:

X. M. Feng et al., "Investigation of 2-DOF Precision Positioning System for IC Packaging", Materials Science Forum, Vols. 628-629, pp. 363-368, 2009

Online since:

August 2009

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Price:

$35.00

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