Quasicontinuum Method Simulation of Nanometric Cutting of Single Crystal Copper

Abstract:

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A multiscale simulation model was built to study the nanometric cutting process of single crystal copper. This multiscale model distinctly reduces the degree of freedom of the whole system compared with full atomistic simulations. Through analyzing the fluctuations of tangential cutting force and strain energy with cutting distance, we confirm that the deformation mechanism of single crystal copper is plastic deformation caused by generation and evolution dislocation. The highest compressive stress locates in shear zone and highest tensile stress locates in the machined surface and subsurface. Simulation results show that there exists a high value of stress around dislocations, which reveals the local high value of stress is the main reason for the generation and evolution of dislocations in the workpiece material.

Info:

Periodical:

Materials Science Forum (Volumes 628-629)

Edited by:

Dongming Guo, Jun Wang, Zhenyuan Jia, Renke Kang, Hang Gao, and Xuyue Wang

Pages:

381-386

DOI:

10.4028/www.scientific.net/MSF.628-629.381

Citation:

Y. C. Liang et al., "Quasicontinuum Method Simulation of Nanometric Cutting of Single Crystal Copper", Materials Science Forum, Vols. 628-629, pp. 381-386, 2009

Online since:

August 2009

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Price:

$35.00

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