The Dimension Accuracy Analysis of a Vacuum Forming Mold for IC Packing Bag

Abstract:

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This article is pointed to the dimension accuracy analysis of the vacuum forming mold for plastic carrier tape. The dimension accuracy of the vacuum forming mold was decided by the dimension specification of the plastic carrier tape. After detail design of the parts which would be manufactured and assembled. The accuracy and performance of the mold had been tested subsequently. The dimension accuracy of the mold was conducted by the accuracy of the plastic carrier tape. Variation of dimensional accuracy of the plastic carrier tape was inspected to evaluate the performance of the vacuum forming mold. Mean and variance test was conducted under the significance level of α = 0.05.Through series of inspections, all the plastic carrier tape met the specification of dimension accuracy which indicated that the precision and performance of the developed vacuum forming mold also met the requirement.

Info:

Periodical:

Materials Science Forum (Volumes 628-629)

Edited by:

Dongming Guo, Jun Wang, Zhenyuan Jia, Renke Kang, Hang Gao, and Xuyue Wang

Pages:

441-446

DOI:

10.4028/www.scientific.net/MSF.628-629.441

Citation:

W. S. Lin et al., "The Dimension Accuracy Analysis of a Vacuum Forming Mold for IC Packing Bag", Materials Science Forum, Vols. 628-629, pp. 441-446, 2009

Online since:

August 2009

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Price:

$35.00

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