Study on the Joint Strength of SiCp/ Al Metal Matrix Composite by Magnetron Sputtering Method

Abstract:

Article Preview

Transient liquid-phase (TLP) bonding of aluminium-based metal matrix composite (MMC) has been investigated. An attempt was made of using an Ag/Cu /Ag film as an interlayer for bonding to improve the joint strength. The oxide on the surface of SiCp/Al MMC was etched completely by plasma. Ag/Cu/Ag film of 8µm thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber. Compared with the same thickness of single Cu foil and Ni foil interlayer, which are widely used for joining SiCp/Al MMC material, the shear strength of 192.8MPa was obtained, which was 86.5% that of base metal. Discussion was made on the bonding process and microstructure.

Info:

Periodical:

Materials Science Forum (Volumes 628-629)

Edited by:

Dongming Guo, Jun Wang, Zhenyuan Jia, Renke Kang, Hang Gao, and Xuyue Wang

Pages:

569-574

DOI:

10.4028/www.scientific.net/MSF.628-629.569

Citation:

R. F. Chen et al., "Study on the Joint Strength of SiCp/ Al Metal Matrix Composite by Magnetron Sputtering Method", Materials Science Forum, Vols. 628-629, pp. 569-574, 2009

Online since:

August 2009

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.