Bonding and Separation Behaviors between Ti-Sn Alloys and High Carbon Steel
Ti-Sn binary alloys (Ti-5 to 20 mol% Sn) were diffusion-bonded to high carbon steel between 1073 and 1273 K for 3.6 ks in a vacuum to investigate the influence of the alloy composition on the interfacial microstructures. Ti-5 and 10 mol% Sn alloys were attached firmly to the steel at a bonding temperature of 1273 K. A continuous TiC layer was formed along the interface, while voids were observed between the TiC layer and the steel. Although the joints with Ti-15 and 20 mol% Sn alloys were also prepared at 1273 K, these joints separated near the interface after the bonding treatment. The TiC layer was formed in the separated surface of Ti-Sn alloy, and Fe in the steel diffused into the Ti-Sn alloy. This indicates that the Ti-15 and 20 mol% Sn alloys established contact with the steel at elevated temperatures until just before the separation. The specimens bonded at 1173 K also denoted the same tendency. However, the Ti-15 mol% Sn/steel joint bonded at 1073 K showed a shear strength of more than 50 MPa. The mechanism and the application of the interface separation are discussed on the basis of the microstructural observations.
T. Chandra, N. Wanderka, W. Reimers , M. Ionescu
Y. Morizono et al., "Bonding and Separation Behaviors between Ti-Sn Alloys and High Carbon Steel", Materials Science Forum, Vols. 638-642, pp. 3787-3792, 2010