Tuning Residual Stress in 3C-SiC(100) on Si(100)

Abstract:

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Germanium modified silicon surfaces in combination with two step epitaxial growth technique consisting in conversion of the Si(100) substrate near surface region into 3C-SiC(100) followed by an epitaxial growth step allows the manipulation of the residual strain. The morphology and the residual strain in dependence on the Ge coverage are only affected by the Ge quantity and not by the growth technique. The positive effect of the Ge coverage is attributed to changes in the morphology during the conversion process, as well as to a reduced lattice and thermal mismatch between SiC and Si in consequence of alloying the near surface region of the Si substrate with Ge.

Info:

Periodical:

Materials Science Forum (Volumes 645-648)

Edited by:

Anton J. Bauer, Peter Friedrichs, Michael Krieger, Gerhard Pensl, Roland Rupp and Thomas Seyller

Pages:

159-162

DOI:

10.4028/www.scientific.net/MSF.645-648.159

Citation:

J. Pezoldt et al., "Tuning Residual Stress in 3C-SiC(100) on Si(100)", Materials Science Forum, Vols. 645-648, pp. 159-162, 2010

Online since:

April 2010

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Price:

$35.00

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