Reduction of Surface Roughness of 4H-SiC by Catalyst-Referred Etching

Abstract:

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Flat and well-ordered surfaces of silicon carbide (SiC) substrates are important for electronic devices. Furthermore, researchers have reported that 4H-SiC surface roughness increases by step-bunching during epitaxial growth and annealing. Degradation of device properties induced by surface roughening is of great concern. Therefore, a method to reduce this surface roughening is requested. We have developed a damage-free planarization method called catalyst-referred etching (CARE). In this paper, we planarized 4H-SiC substrates and evaluated the processed surface before and after the epitaxial growth. Then, we reduced the step-bunching on the epi-wafer surface and determined the electrical properties of the Schottky barrier diodes (SBD) on the processed surface.

Info:

Periodical:

Materials Science Forum (Volumes 645-648)

Edited by:

Anton J. Bauer, Peter Friedrichs, Michael Krieger, Gerhard Pensl, Roland Rupp and Thomas Seyller

Pages:

775-778

DOI:

10.4028/www.scientific.net/MSF.645-648.775

Citation:

T. Okamoto et al., "Reduction of Surface Roughness of 4H-SiC by Catalyst-Referred Etching", Materials Science Forum, Vols. 645-648, pp. 775-778, 2010

Online since:

April 2010

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$35.00

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