Vacuum Adhesive Bonding and Stress Isolation for MEMS Resonant Pressure Sensor Package

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This paper presents a method of low temperature adhesive bonding and stress isolation for MEMS resonant pressure sensor hermetic packaging using non-photosensitive benzo-cyclo-butene (BCB) from Dow Co. According to the bonding process, pre-bake time, pumping time, pressure placed on the sensor and the thickness of crosslink layer are the most important factors. Stress isolation is designed to minimize thermal stresses to the resonant pressure sensor package. Experimental results show that this bonding process is a viable for MEMS resonant pressure sensor with the bonding temperature below 250°C, measured bonding strength more than 30MPa, the temperature drift less than 0.05%/°C in the range of -40°C to 70°C(10% of that without stress isolation), and the bonding strength maintains well after thermal treatments, handling, bench testing and implantations.

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Periodical:

Edited by:

Ran Chen

Pages:

896-900

DOI:

10.4028/www.scientific.net/MSF.694.896

Citation:

Y. X. Li et al., "Vacuum Adhesive Bonding and Stress Isolation for MEMS Resonant Pressure Sensor Package", Materials Science Forum, Vol. 694, pp. 896-900, 2011

Online since:

July 2011

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$35.00

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