A Study on Adhesive Properties of a Damascene Electroplated Cu Composite Sheet

Abstract:

Article Preview

In this paper, it was aimed to develop a new interconnect material having high electrical conductivity and strength simultaneously. The Cu composite sheet, possessing mesh type Ag conduction paths on the surface of a high strength Cu alloy sheet, was manufactured by damascene electroplating. The peel strength of Cu composite sheet prepared by damascene electroplating increased by above 50 times compared to Cu composite sheet by conventional electroplating. Al wire wedge bonding was able to be successfully conducted without extra metal thin film coating.

Info:

Periodical:

Edited by:

Hyungsun Kim, Jian Feng Yang, Chuleol Hee Han, Somchai Thongtem and Soo Wohn Lee

Pages:

577-580

DOI:

10.4028/www.scientific.net/MSF.695.577

Citation:

H. K. Moon et al., "A Study on Adhesive Properties of a Damascene Electroplated Cu Composite Sheet", Materials Science Forum, Vol. 695, pp. 577-580, 2011

Online since:

July 2011

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.