Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior


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Chemical mechanical polishing (CMP) has become the most widely used planarization technology in the semiconductor manufacturing process. In this paper, the distinguish method of lubricating behavior in wafer CMP had been analyzed in theory firstly. Then, the tests of wafer CMP with silicon wafer and deposited copper wafer at different polishing pressure had been done. By the test results, the Stribeck curves obtained showed obvious smooth. But in normal wafer CMP conditions, the friction coefficient of polishing area was above 0.1. By analyzing the experimental results, it was concluded that the lubrication state in CMP interface is belong to the boundary lubrication and the material removal is the process of bringing and removed of the chemical reaction boundary lubricating film on wafer surface constantly. The contact form between the Wafer and the polishing pad is the solid-solid contact. These results will provide theoretical guide to further understand the material removal mechanism of in wafer CMP. Keywords: Chemical mechanical polishing, material removal mechanism, lubrication form, boundary lubrication.



Materials Science Forum (Volumes 704-705)

Edited by:

Jitai Niu and Guangtao Zhou




S. F. Zhang et al., "Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior", Materials Science Forum, Vols. 704-705, pp. 313-317, 2012

Online since:

December 2011




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