A Model for Recovery Kinetics of Aluminum after Large Strain


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A model is suggested to analyze recovery kinetics of heavily deformed aluminum. The model is based on the hardness of isothermal annealed samples before recrystallization takes place, and it can be extrapolated to longer annealing times to factor out the recrystallization component of the hardness for conditions where recovery and recrystallization overlap. The model is applied to the isothermal recovery at temperatures between 140 and 220°C of commercial purity aluminum deformed to true strain 5.5. EBSD measurements have been carried out to detect the onset of discontinuous recrystallization. Furthermore, comparison between the present model and a similar recently developed recovery model is made, and the result is discussed.



Materials Science Forum (Volumes 715-716)

Edited by:

E.J. Palmiere and B.P. Wynne




T. B. Yu and N. Hansen, "A Model for Recovery Kinetics of Aluminum after Large Strain", Materials Science Forum, Vols. 715-716, pp. 374-379, 2012

Online since:

April 2012




[1] X. Huang: Scripta Mater. Vol. 60 (2009), p.1078.

[2] O.V. Mishin and A. Godfrey: Metall. Mater. Trans. A Vol. 39A (2008), p.2923.

[3] W.Q. Cao, A. Godfrey, N. Hansen and Q. Liu: Metall. Mater. Trans. A Vol. 40A (2009), p.204.

[4] N. Hansen, X. Huang, M.G. Møller and A. Godfrey: J Mater. Sci. Vol. 43 (2008), p.6254.

[5] R.A. Vandermeer and N. Hansen: Acta Mater. Vol. 56 (2008), p.5719.

[6] R.A. Vandermeer and D. Juul Jensen: Acta Mater. Vol. 49 (2001), p. (2083).

[7] G. Borelius, S. Berglund and S. Sjoberg: Arkiv Fysik Vol. 6 (1953), p.143.

[8] O.V. Mishin, D. Juul Jensen and N. Hansen: In this proceeding.

[9] O.V. Mishin, D. Juul Jensen and N. Hansen: Metall. Mater. Trans. A Vol. 41A (2010), p.2936.

[10] T. Yu, N. Hansen, X. Huang and G. Winther, in: Proceedings of the 30th Risø International Symposium on Materials Science: Nanostructured Metals, Risø, Denmark (2009), p.393.

[11] A. Oscarsson, H-E. Ekstrom and B. Hutchinson: Mater. Sci. Forum Vol. 113-115 (1993), p.177.