Packaging Technologies for 500°C SiC Electronics and Sensors

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This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500°C silicon carbide (SiC) electronics and sensors, and test results of packaged SiC JFETs and capacitive pressure sensors at 500°C.

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Periodical:

Materials Science Forum (Volumes 717-720)

Edited by:

Robert P. Devaty, Michael Dudley, T. Paul Chow and Philip G. Neudeck

Pages:

1033-1036

Citation:

L. Y. Chen et al., "Packaging Technologies for 500°C SiC Electronics and Sensors", Materials Science Forum, Vols. 717-720, pp. 1033-1036, 2012

Online since:

May 2012

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$41.00

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