Packaging Technologies for 500°C SiC Electronics and Sensors
This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500°C silicon carbide (SiC) electronics and sensors, and test results of packaged SiC JFETs and capacitive pressure sensors at 500°C.
Robert P. Devaty, Michael Dudley, T. Paul Chow and Philip G. Neudeck
L. Y. Chen et al., "Packaging Technologies for 500°C SiC Electronics and Sensors", Materials Science Forum, Vols. 717-720, pp. 1033-1036, 2012