On the Fabrication Parameters of Buried Microchannels Integrated in In-Plane Silicon Microprobes

Abstract:

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This paper aims the characterization of buried microchannels in silicon realized by deep reactive ion etching. The effects of dry etching parameters on the integrability into hollow microprobes are thoroughly investigated from both technological and functional aspects. Results are supposed to give physiology related probe designers a deeper insight into microfabrication-related issues.

Info:

Periodical:

Edited by:

T. Berecz, K. Májlinger, I. N. Orbulov and P. J. Szabó

Pages:

210-215

DOI:

10.4028/www.scientific.net/MSF.729.210

Citation:

Z. Fekete et al., "On the Fabrication Parameters of Buried Microchannels Integrated in In-Plane Silicon Microprobes", Materials Science Forum, Vol. 729, pp. 210-215, 2013

Online since:

November 2012

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Price:

$35.00

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