Effect of Dealloying Process on Microstructure and Electrochemical Properties of Ni Foam


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Ni foam with 3D porous structure has attracted attention in the field of catalysis. Expanding the specific surface area of Ni foam is an important method to enhance its chemical properties. In this study, the Cu-Ni/Ni foam were obtained by electroless plating copper on Ni foam and then heat treatment for homogenizing at 750°C. The dealloying of the Cu-Ni/Ni foam was carried out by electrochemical etching for obtaining the Ni foam with hierarchical pore structure. The microstructure, phase and electrochemical performance were characterized by SEM, XRD and electrochemical testing. The results showed that the optimized temperature of electroless plating Cu on Ni foam is 60oC. Ni-Cu alloy can be obtained by counter diffusion above 750°C. With prolonging time of etching, the content of Cu component decreased and the size of pores on the sturts of the Cu-Ni/Ni foam changed from nano to micro scale. The electrochemical properties of the alloywere significantly higher than that of the pure nickel foam.



Edited by:

Junichi Hojo, Tohru Sekino, Jian Feng Yang, Hyung Sun Kim and Wen Bin Cao




G. Y. Hou et al., "Effect of Dealloying Process on Microstructure and Electrochemical Properties of Ni Foam", Materials Science Forum, Vol. 922, pp. 3-7, 2018

Online since:

May 2018




* - Corresponding Author

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