Double Step Annealing for the Recovering of Ion Implantation Defectiveness in 4H-SiC DIMOSFET

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Thermal annealing plays a crucial role for healing the defectiveness in the ion implanted regions of DIMOSFETs (Double Implanted MOSFETs) devices. In this work, we have studied the effect of a double step annealing on the body (Al implanted) and the source (P implanted) regions of such devices. We found that a high temperature annealing (1750°C, 1h) followed by a lower temperature one (1500°C, 4h) is mandatory to achieve low defects concentration and good crystal quality in both the n-and p-type zones of the device.

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Edited by:

Robert Stahlbush, Philip Neudeck, Anup Bhalla, Robert P. Devaty, Michael Dudley and Aivars Lelis

Pages:

357-360

Citation:

M. Zimbone et al., "Double Step Annealing for the Recovering of Ion Implantation Defectiveness in 4H-SiC DIMOSFET", Materials Science Forum, Vol. 924, pp. 357-360, 2018

Online since:

June 2018

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