The Development of High Thermal Conductivity SiC Power Modules through the Implementation of Advanced Cooling Techniques Coupled with High Heat Transfer Materials

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This paper discusses Wolfspeed’s advances in silicon carbide (SiC) power module packaging, focusing on recent developments in advanced power module heat transfer techniques, the integration of pinfin mechanical structures, and the implementation of advanced die attach materials. Heat spreader materials and novel cooling methods suitable for SiC power modules are presented, focusing on the thermal heat transfer properties and a discussion of the design and prototype experimental impacts.

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Edited by:

Robert Stahlbush, Philip Neudeck, Anup Bhalla, Robert P. Devaty, Michael Dudley and Aivars Lelis

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866-870

Citation:

B. Passmore et al., "The Development of High Thermal Conductivity SiC Power Modules through the Implementation of Advanced Cooling Techniques Coupled with High Heat Transfer Materials", Materials Science Forum, Vol. 924, pp. 866-870, 2018

Online since:

June 2018

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