Effect of Chemical Solution on the Stability of Low-k Films

Abstract:

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The compatibility of chemical solutions with different pH is studied on microporous silica-based (SiOCH) and mesoporous methylsilsesquioxane (MSQ) based low-k materials. The surface and bulk properties of as-deposited and O2/CF4 plasma-treated low-k films have been studied after several wet treatments.

Info:

Periodical:

Solid State Phenomena (Volumes 103-104)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

349-352

DOI:

10.4028/www.scientific.net/SSP.103-104.349

Citation:

E. Kesters et al., "Effect of Chemical Solution on the Stability of Low-k Films", Solid State Phenomena, Vols. 103-104, pp. 349-352, 2005

Online since:

April 2005

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Price:

$35.00

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