Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test

Abstract:

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The interfacial reactions and shear properties of Sn-37Pb (wt.%) solder bumps with two different under bump metallizations (UBMs), Cu and Ni, were investigated after high temperature storage (HTS) tests at 150 C for up to 65 days. Two different intermetallic compounds (IMCs), Cu6Sn5 and Cu3Sn, were formed at the bump/Cu interface, whereas only a Ni3Sn4 IMC layer was formed at the bump/Ni interface. The thicknesses of these IMCs increased linearly with the square root of duration time. The IMC growth rate at the bump/Cu UBM interface was much greater than that at the bump/Ni UBM interface. The shear properties of the bumps with the Cu UBM were greatly decreased with increasing duration time, compared with those with the Ni UBM.

Info:

Periodical:

Solid State Phenomena (Volumes 124-126)

Edited by:

Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park

Pages:

5-8

DOI:

10.4028/www.scientific.net/SSP.124-126.5

Citation:

J. M. Koo et al., "Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test", Solid State Phenomena, Vols. 124-126, pp. 5-8, 2007

Online since:

June 2007

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$35.00

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