Characteristics of Thermal Performance in High Power LED Package with Heat Pipe


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This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.



Solid State Phenomena (Volumes 124-126)

Edited by:

Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park






W. J. Hwang et al., "Characteristics of Thermal Performance in High Power LED Package with Heat Pipe", Solid State Phenomena, Vols. 124-126, pp. 85-88, 2007

Online since:

June 2007




[1] Linthicum, Hanser, Zheleva, Nam, Davis: Naval Research Reviews. Vol. 51 (1999), p.46.

[2] Tae Hee Lee, Lan Kim, Woong Joon Hwang, C. C. Lee, Moo Whan Shin: phys. stat. sol. (b). Vol. 241 (2004), p.2681.

DOI: 10.1002/pssb.200405099

[3] Adam Christensen, David Nicol, Ian Ferguson, Samuel Graham: Fifth International Conference on Solid State Lighting. Vol. 5941 (2005).

DOI: 10.1117/12.625956

[4] Kenichi Namba, Jun Niekawa, Yuichi Kimura, Nobuyuki: IEEE Trans. Compon. Packag. Technol. Vol. 23 (2000), p.91.

[5] K.C. Leong, C.Y. Liu and G.Q. Lu: Journal of Porous Materials. Vol. 4 (1997), p.303.

[6] V. Székely and Tran Van Bien: Solid-State Electronics. Vol. 31 (1988), p.1363.

[7] Péter Szabó, Oliver Steffens, Michael Lenz, Gábor Farkas: IEEE Trans. Compon. Packag. Technol. Vol. 28, No. 4, p.630 (2005).

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