Paper Title
Authors: Seong Min Lee
Abstract:This study examines how the increased density of passivated metallic conductor lines caused by large circuit integration in semiconductor...
Authors: Ja Myeong Koo, Dea Gon Kim, Seung Boo Jung
Abstract:The interfacial reactions and shear properties of Sn-37Pb (wt.%) solder bumps with two different under bump metallizations (UBMs), Cu and...
Authors: Min Seung Yoon, Oh Han Kim, Young Chang Joo, Young Bae Park
Abstract:In-situ observation by scanning electron microscope of the microstructure evolution near the cathode depletion region and the quantitative...
Authors: Chong Mu Lee, Keun Bin Yim, Anna Park, Ho Jin Kim
Abstract:The structure and electrical properties of ZrO2 dielectric thin films deposited by rf magnetron sputtering were investigated. The fixed...
Authors: Seung Woo Han, Kyoung Wan Park, Jung Hyun Sok
Abstract:Resistance-switching behaviors of the Pr0.7Ca0.3MnO3(PCMO) films based metalinsulator- metal (MIM) devices has been investigated. In this...
Authors: Myoung Sub Kim, Jin Hyung Jun, Jin Ho Oh, Hyeong Joon Kim, Jae Sung Roh, Suk Kyoung Hong, Doo Jin Choi
Abstract:Ge2Sb2Te5 (GST) has been widely studied for PRAM as reversible phase change material. GST is expected to reduce RESET (crystalline →...
Authors: Boo Yang Jung, Eun Kyoung Choi, Young Soo Jeon, Kwang Yong Lee, Kwang Seok Seo, Tae Sung Oh
Abstract:For flip-chip process of RF system-on-packages(SOP), double bump bonding processes were investigated. Sn-Ag and Sn solder joints were formed...
Authors: Nam Hoon Kim, Hae Young Yoo, Eui Goo Chang
Abstract:The ambient and denuded trench top corner at the step of gate oxidation play an important role to generate defect. Furthermore,...
Showing 1 to 10 of 461 Paper Titles