Ultra Clean Processing of Semiconductor Surfaces VIII
Paper Title Page
Abstract: We have investigated the use of Rs and SIMS measurements to quantify substrate erosion due to plasma ashing and subsequent wet cleaning...
Abstract: With the continuous shrinkage of critical sizes in semiconductor manufacturing, nano-particles smaller than 100-nm are becoming a potential...
Abstract: The purpose of this study is to investigate the effects of slurry pH on the adhesion and removal of silica and ceria abrasive particles on...