Cleaning Technique Using High-Speed Steam-Water Mixed Spray

Abstract:

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A novel cleaning technique using steam-water mixed spray is proposed. Relatively low-pressure super-purified steam (0.1 MPa - 0.2 MPa) is mixed with super-purified water in a nozzle, and then sprayed on a silicon wafer surface, which is located at approximately 10 mm from the nozzle. The most striking result of this proposed technique is that we are able to clean a wafer surface, i.e., to eliminate fine particles, without using any chemicals.

Info:

Periodical:

Solid State Phenomena (Volumes 145-146)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

43-46

DOI:

10.4028/www.scientific.net/SSP.145-146.43

Citation:

M. Watanabe et al., "Cleaning Technique Using High-Speed Steam-Water Mixed Spray", Solid State Phenomena, Vols. 145-146, pp. 43-46, 2009

Online since:

January 2009

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Price:

$35.00

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