Measurement of Adhesion Force of Resist to Wafer by Using SAICAS: Characteristics of Lift-Off of Resist by Steam-Water Mixed Spray

Abstract:

Article Preview

We performed two experiments on resist-coated wafers. In the measurement of the resist-wafer adhesivity, we confirmed that it is significantly increased by an HMDS layer in between. In the resist-removal experiment using steam-water mixed spray, we found that the area of resist removal is limited within the area of spray application if HMDS is used, otherwise the former can be larger than the latter. These results suggest that the resist removal from a wafer surface by steam-water mixed spray is essentially a peel-off process.

Info:

Periodical:

Solid State Phenomena (Volume 187)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

85-88

Citation:

T. Mashiko et al., "Measurement of Adhesion Force of Resist to Wafer by Using SAICAS: Characteristics of Lift-Off of Resist by Steam-Water Mixed Spray", Solid State Phenomena, Vol. 187, pp. 85-88, 2012

Online since:

April 2012

Export:

Price:

$38.00

[1] M. Watanabe, T. Sanada, A. Hayashida and Y. Isago: Solid State Phenom. Vol. 145-146 (2009), p.43.

[2] T. Sanada, M. Watanabe, A. Hayashida and Y. Isago: Solid State Phenom. Vol. 145-146 (2009), p.273.

[3] T. Mashiko, A. Hayashida, Y. Yamada, T. Sanada and M. Watanabe: ECS Trans. Vol. 25 (2009), p.233.

[4] H. Horibe, M. Fujita, I. Nishiyama and A. Yoshikado: Jpn. J. Appl. Phys. Vol. 44 (2005), p.8673.

[5] F. Saito, I. Nishiyama and T. Hyodo: Mater. Lett. Vol. 63 (2009), p.2257.