Investigation of the Evaporation and Wetting Mechanism of IPA-DIW Mixtures


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In semiconductor fabrication, mixtures of isopropyl alcohol (IPA) and deionized water (DIW) are commonly used in wafer cleaning processes due to their superior wetting and drying performance on many types of substrates. To achieve a maximum cleaning performance with reduced IPA consumption, it is of great interest to understand the wetting mechanism of such mixtures. In this work, we investigate the spreading and evaporation process of IPA-DIW drops with different concentrations.



Solid State Phenomena (Volume 195)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns




X. M. Xu et al., "Investigation of the Evaporation and Wetting Mechanism of IPA-DIW Mixtures", Solid State Phenomena, Vol. 195, pp. 223-226, 2013

Online since:

December 2012




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